Challenges to Overcome in Power Module Packaging Industry Market Growth: Analysis 2025-2033The Power Module Packaging market is booming, projected to reach \$2.5 billion by 2025, with a 9.78% CAGR. Driven by EVs, renewable energy, and industrial automation, this report analyzes market trends, key players (Toshiba, Infineon, Texas Instruments), regional growth, and technological advancements in substrate, die attach, and more. Discover future market projections and growth opportunities.
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